Intel has revealed more details on its upcoming 3D Foveros packaging technology, which it will be using to built its next-gen Meteor Lake, Arrow Lake, and Lunar Lake CPUs of the future. The company ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

While two-dimensional art makes sense on paper, it sort of falls apart in the real world, which is 3D all the way. But chip ...

Intel is preparing its own chip-stacking technology to rival AMD’s "3D V-cache" tech, according to CEO Pat Gelsinger. But don’t expect Intel to take the same chip-stacking approach as AMD, which has ...

Developers of three-dimensional rendering technology for the Web known as X3D are bracing for a standards war with Intel--a former backer of the project--just as their recently sundered collaboration ...

An experimental new Steam Deck rival from Intel and Chinese behemoth Tencent has just been announced. The Sunday Dragon 3D One is a fully featured gaming handheld PC that comes with Nintendo ...