Left-shifting DFT, scalable tests from manufacturing to the field, enabling system-level tests for in-field debug.

TL;DR: Intel's new Fab 52 in Chandler, Arizona, produces the most advanced US-made logic chips using the cutting-edge 18A process node, featuring RibbonFET and PowerVia innovations. This facility is ...

In today’s rapidly evolving semiconductor landscape, System-on-Chips (SoCs) are becoming increasingly complex, integrating multiple processing cores, specialized accelerators and vast memory arrays.

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, ...

[This is a sponsored article with Selangor Information Technology & Digital Economy Corporation (Sidec).] For decades, Malaysia has played a crucial role in the global semiconductor industry, ...

SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced test ...

Kinex™ is the industry’s first integrated die-to-wafer hybrid bonding system; enables production of higher performance, lower power advanced logic and memory chips Xtera™ system enables higher ...

System-level test (SLT), once used largely as a stopgap measure to catch issues missed by automated test equipment (ATE), has evolved into a necessary test insertion for high-performance processors, ...

Global sales of equipment for semiconductor manufacturing by original equipment manufacturers (OEMs) is forecast to reach a ...