MOE Key Laboratory for Advanced Materials Processing Technology, Tsinghua has the following research output in the current window (1 January 2025 - 31 December 2025) of the Nature Index. Click on ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

A new joint study uncovers the remarkable potential of ultrafast lasers that could provide innovative solutions in 2D materials processing for many technology developers such as high-speed ...

4.5.1. HD Microsystem 's polyimide solution for hybrid bonding - 1 4.5.2. HD Microsystem 's polyimide solution for hybrid bonding - 2 4.5.3. Showa Denko Copper/Polyimide hybrid bonding - 1 4.5.4.

Plasma processing technologies are of vital importance to several of the largest manufacturing industries in the world. Foremost among these industries is the electronics industry, in which ...

Femtosecond laser based micro/nano processing involves studies of numerous aspects: fundamentals and unique phenomena of fs-laser pluses and matter interactions, pulse-shaping and high throughput ...

Workers wear protective equipment in a cavernous hall that contains industrial equipment. The tokamak hall at Commonwealth Fusion Systems’ fusion energy facility in Devens, Massachusetts, will house ...

Solvay S.A. (Brussels, Belgium) announced it has entered into a Letter of Intent (LOI) with Viridis Mining and Minerals to ...

A new joint study by Aleksei Emelianov, Mika Pettersson from the University of Jyväskylä, and Ivan Bobrinetskiy from Biosense Institute (Serbia) explores the remarkable potential of ultrafast laser ...