TAIPEI, Feb 5 (Reuters) - ASE Technology Holding, the world's largest chip packaging and testing provider, on Thursday said ...

WENZHOU, ZHEJIANG PROVINCE, CHINA, January 19, 2026 /EINPresswire.com/ -- As the global pharmaceutical and healthcare ...

Q4 2025 Management View Group COO Tien Wu outlined a multiyear outlook, emphasizing that "the AI server cycle continues, primarily led by hyperscaler and the data center development." Wu reported that ...

Investments in automation and additional tools for data analytics keep coming to packaging lines as plants become more connected. Machine learning and digital twin technology are increasing throughput ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...

Diamond Quanta today announced Adamantine Thermal(TM), an engineered-diamond thermal platform designed for integration into advanced packaging workflows and heterogeneous semiconductor systems. The ...

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

FPT Announces the Establishment of an Advanced Semiconductor Testing & Packaging Plant ...

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, ...

The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...

FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia ...