Claiming to be able to find the faults missed by X-ray inspection systems, the 3D-Bga inspection system detects hard-to-find faults such as the presence of flux, micro cracks, and cold solder joints.

In recent years, the area array components like BGA, QFN, CSP, and flip chips, are aplicate wider and wider in the electronics manufacturing. Such as BGA, comparing with other components, it has ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Quad-flat-pack no-lead devices (QFNs) attach to boards in different ways from conventional quad flat-packs (QFPs). Manufacturers have to inspect boards with QFNs differently as well. I asked Jeremy ...