EDN

ADE debuts 3D metrology tool for copper CMP

SAN FRANCISCO–ADE Corp. introduced what the company claims is the first non-contact, inline 3-D metrology system for copper CMP processes. NanoXam is said to measure copper dishing of wide lines and ...
EDN

Rohm and Haas Unveils New ACuPLANE™ Copper Barrier CMP Solution

HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
Business Wire

Applied Materials Extends Copper/Low k Leadership with Innovative CMP Technology; Reflexion LK CMP System Planarizes Delicate Low k Interconnects at High Production Speeds

SANTA CLARA, Calif.--(BUSINESS WIRE)--June 25, 2003--Applied Materials, Inc. (Nasdaq:AMAT) announces Reflexion(R) LK, the industry's only low down force, high throughput CMP (chemical mechanical ...