Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...

TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...

Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

More details are emerging about TSMC's massive investment in chip manufacturing on U.S. soil, which now reportedly includes ...

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

TL;DR: NVIDIA's B300 AI chip production is accelerated to May, utilizing TSMC's advanced 5nm N4P process and CoWoS-L packaging. Featuring Bianca compute boards with 1 CPU and 2 GPUs, the B300 aims to ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology. Rumors about the iPhone 18 ...