What are the qualifications of the people conducting IDTechEx research? Content produced by IDTechEx is researched and written by our technical analysts, each with a PhD or master's degree in their ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

New report shows 2.5D and 3D packaging market could grow 26% annually, outpacing overall chip industry growth as AI moves from data centers into PCs, smartphones and vehicles TSMC expected to maintain ...

Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response ...

According to Dr. Richard Thurston, CEO of GLS, the partnership leverages both companies' technology portfolios by tightly integrating GLS's proprietary chip fabrication processes with advanced ...

Companies to collaborate on R&D to accelerate introduction of advanced packaging technologies for next-generation AI chips and systems ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Ever since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the ...

Touch panel maker TPK is partnering with semiconductor packaging giant ASE to enter the advanced through-glass via (TGV) packaging technology sector, focusing on developing glass substrates for ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

A new technical paper, “Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000,” was published by researchers at KAIST. The study presents ...

PETALING JAYA: Malaysia aims to develop domestic capability in advanced semiconductor packaging within two years through the establishment of the Malaysia Advanced Packaging Consortium. Science, ...

The MarketWatch News Department was not involved in the creation of this content. FISHKILL, N.Y., Feb. 24, 2026 /PRNewswire/ -- Great Lakes Semiconductor (GLS) and Advanced Printed Electronic ...