OrbitIO interconnect designer capabilities deliver hierarchical multi-substrate-optimized design for SoCs and ASICs across IC package/SiP and systems SAN JOSE, Calif., May. 04, 2016 – Cadence Design ...

American Packaging Corporation (APC) continues to expand its sustainable packaging offerings with Design for Recycle (or ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

Dezeen Competitions: The Salmon Packaging Design Competition tasks designers with creating innovative packaging using corrugated cardboard sourced from sustainable and renewable materials. The ...

Advanced packaging techniques are viewed as either a replacement for Moore’s Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can ...

The Army’s premier training for military packaging has a new home. The Army Sustainment Command Packaging, Storage, and Containerization Center (PSCC), located on-post at Tobyhanna Army Depot, has ...