Heat-sink devices and technology have many aspects, but I am hooked on basic models of varying sizes and fabrication ...
The PowerSite attachment lets power semiconductors mount directly onto heat sinks without mechanical fasteners. The PowerSite process selectively bonds insulated copper pads onto aluminum heat sinks.
Thermally conductive thermoplastics for heat sinks and thermal management dissipate the same amount of heat as aluminum but are up to 50% lighter. They also have no antenna effect (no amplification of ...
When choosing an effective heat sink, engineers usually consider its price, size, weight, performance and other features. But equal care should be given to deciding how the heat sink will be attached ...
TODAY'S CUTTING EDGE INTEGRATED CIRCUITS DISSIPATE SUBSTANTIALLY HEAVIER LOADS OF HEAT THAN EVER BEFORE. At the same time, the premium associated with miniaturized applications has never been greater, ...
As the heat density increases at the die level of more powerful semiconductor devices, there becomes a greater need for new and innovative cooling solutions. Standard Aluminum extrusions and bonded ...
When facing the task of cooling heavily populated PCBs (printed-circuit boards), de-signers must understand that careful management of airflow along the boards is the key to effective cooling. In ...
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