One of the biggest benefits of modern mechanical design software is speed. Tasks that once took days can now be completed in ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Vinci today announced the ...

Electronic packaging has continued to become more complex with higher device count, higher power densities and Heterogeneous Integration (HI) becoming more common. In the mobile space, systems that ...

Imagine you're building an unmanned aerial vehicle (UAV), a cutting-edge electric vehicle or a self-driving car. Not long ago, this would’ve meant years of physical ...

“Addressing complex engineering challenges such as developing products that are more powerful, yet greener, lighter yet stronger requires a fully-integrated CAE solution,” said Jean-Claude Ercolanelli ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Vinci today announced the availability of its second core physics capability: thermo-mechanical simulation that predicts “warpage” in hardware designs: how they bend, twist, and deform under ...

Vinci’s physics AI foundation model delivers deterministic, solver-accurate warpage analysis across extreme scales—already in production use at leading hardware companies Building on its ...