Micron Technology (NasdaqGS:MU) starts volume production of next generation HBM4 memory a quarter ahead of its prior timeline. The company reports that all of its 2026 HBM capacity is already sold out ...

The speed of data transfer between memory and the CPU. Memory bandwidth is a critical performance factor in every computing device because the primary CPU processing is reading instructions and data ...

Artificial intelligence is shifting the center of gravity in semiconductors. For decades, processors defined performance. Now ...

Innodisk, a leading provider of industrial-grade memory solutions, announced the CXL Add-in Card (AIC), a major addition to ...

With doubled I/O interfaces and refined low voltage TSV design, HBM4 reshapes how memory stacks sustain throughput under data ...

AMD's next-generation 'Halo' APU seems likely to use bleeding-edge LPDDR6 memory for nearly double the bandwidth.

(CNN) — The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth ...

That’s a nine-fold expansion in four years. No segment in chip history has ever scaled that fast at that size. By 2026, memory alone is projected to reach $550 million to $570 billion — roughly 55% to ...

Per-stack total memory bandwidth has increased by 2.7-times versus HBM3E, reaching up to 3.3 Tb/s. With 12-layer stacking, Samsung is offering HBM4 in capacities from 24 gigabytes (GB) to 36 GB, and ...