When a multi-die package worth $500 fails final test because of a defect that originated three process steps earlier, the economics of advanced packaging become painfully clear. Each excursion carries ...

Many packaging companies are turning to systems that combine the stretch blow molding (SBM) process with the bottling process in a single production flow. Pneumatic technologies can solve PET ...

Lam Research (NasdaqGS:LRCX) has reportedly held takeover talks with BE Semiconductor Industries (BESI). The discussions point to potential M&A activity that could affect the semiconductor equipment ...

The role of packaging/assembly/test (P/A/T) in the overall successful commercialization of MEMS (microelectromechanical systems) has historically taken a backseat to device development. In the ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

The global market for packaging equipment market will grow from its current value of more than $38 billion, pushing past $47 billion by 2024, according to a new research report by Global Market ...