A virtual DOE-based process sensitivity check was performed for two tiers of channel holes in a 3D NAND device. The channel hole tilt distance, twist angle, and their sensitivities to the visible area ...

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Honeywell and Danfoss are partnering to integrate variable frequency drive (VFD) technology with Honeywell's Experion Process Knowledge System platform to streamline motor control, reduce energy ...

Over the past few decades, various control disciplines like process, batch, motion and discrete control have been consolidated into a single, common automation architecture. This integration has ...