A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Ever since former Intel CEO Pat Gelsinger announced in 2021 that Intel was entering the ...

Led by Professor Tony Feng Shien-Ping from the Department of Systems Engineering at CityUHK, the research team developed a novel material to address the complex metallisation challenges in the ...

Samsung is reportedly considering a $4 billion chip packaging and testing project in Vietnam, deepening the country’s role in the global semiconductor supply chain. Samsung Electronics is planning a ...

As semiconductor packaging technologies evolve, advanced methods like 2.5D and 3D Cu-to-Cu hybrid bonding are essential for achieving higher performance and power efficiency. However, manufacturing ...

Launched in 2021, ISM 1.0 was conceived as a state-backed push to build a full-stack chip ecosystem. The FM announced ISM 2.0 in the 2026 Budget to produce equipment and materials, design full-stack I ...

Use left and right arrow keys to seek audio. TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at ...

Semiconductors power almost every aspect of modern life, from smartphones and televisions to cars, satellites, fighter jets, and the artificial intelligence revolution. But what exactly are ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...