Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

AI helps packaging teams design faster, use less material and improve performance through data-driven modelling, simulation and optimisation tools.

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

Chromatography is an important and ubiquitous unit operation in downstream bioprocessing. Currently, there are three different ways to pack process chromatography columns: • Flow packing, which uses ...