They published their work on Sep. 12 in Energy Material Advances. "The great electrochemical phase-field simulation efforts devoted to exploring the dendrite growth mechanism under the temperature ...
The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
Although it is common knowledge that their efficiency is poor, Peltier thermoelectric elements are considered the most versatile cooling elements; they are used in a wide range of applications, such ...
Starting from 2008, Fraunhofer IISB will market its advanced and proven lithography simulation models and software algorithms in its development and research simulator Dr.LiTHO. The software can be ...
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