In a nutshell: JEDEC has announced the HBM3 standard. And, like any good revision to a memory standard, it features a minor decrease in voltage, a slew of added conveniences, and a doubling of all the ...

So currently, the latest tech makes it possible to stack 64-layers of cells into a NAND chip, which let's be honest here is already a huge achievement. Well, by 2021 that number will have increased ...

AMD’s upcoming Zen 6 chips are shaping up to be pretty interesting. First off, these new dies will house 12 cores each instead of the eight we’ve seen up to now. That means a dual-die Ryzen 9 could ...