TL;DR: Intel's 18A process node, set for tape-out in 1H 2025, aims to compete with TSMC, marking a significant comeback for Intel in the semiconductor industry. Featuring BSPDN, RibbonFET GAA ...
Why it matters: As Intel's chip design and foundry businesses face mounting pressure that could jeopardize the company's future, much is riding on the success of its upcoming 18A node. As Intel ...
Ubitium, a German semiconductor start-up, announced the tape-out of its first silicon on Samsung Foundry's 8nm process. The tape-out was completed in December 2025. The chip is the first universal ...
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