Electronic Design

How the Tessent Streaming Scan Network Addresses Next-Gen IC Test

There's a growing demand for next-generation ICs to deliver the extreme performance required for fast-evolving applications, such as AI and self-driving cars, putting tremendous pressure on the size ...
Semiconductor Engineering

Packetized Scan Test

Bus-based packetized scan data decouples test delivery and core-level DFT requirements so core-level compression configuration can be defined completely independently of chip I/O limitations. Grouping ...
Design-Reuse

Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi die solution

Plano, Texas, USA -- September 26, 2022-- Siemens Digital Industries Software today introduced the Tessent™ Multi-die software solution, which helps customers dramatically speed and simplify critical ...
Business Wire

Mentor Graphics Tessent YieldInsight Demonstrates Faster IC Failure and Yield Analysis at Fujitsu

WILSONVILLE, Ore.--(BUSINESS WIRE)--Mentor Graphics Corporation (NASDAQ: MENT) today announced evaluation results at Fujitsu Semiconductor Ltd. that shows the Tessent ® YieldInsight ® diagnosis-driven ...
Electronic Design

Talking About Mentor’s Tessent Streaming Scan Network and how it Addresses Next-Gen IC Test

Addressing the complexity of modern ICs and their multiple cores is a challenge to the testing community. Mentor's Tessent Streaming Scan Network can ease this problem. We talk to the company's Geir ...