Flip chip packaging represents a cutting‐edge assembly technique in which semiconductor devices are mounted upside‐down, enabling direct connection to the substrate via solder bumps. This method not ...

Flip Chip packaging has found limited use for a technology that was introduced decades ago. Its application widened with the use of underfill, a necessary constituent to minimizing CTE mismatch ...

This white paper tackles the importance of epoxy-based underfill encapsulants in flip chip technology and semiconductor industry. This is a guide on selecting compounds and enhancing the reliability ...

The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as Flip Chip technology. In most cases, ...

The UA-2605 reworkable edgebond adhesive promises to improve thermal cycle performance of CBGAs and plastic BGAs. In one case, it tripled the 0°C to +100°C performance of a CBGA to nearly 2500 cycles.