FREMONT, Calif.–Lam Research Corp. here today introduced a new platen for its 200-mm wafer chemical mechanical planarization (CMP) system designed to extend reliable control of polishing processes ...

Chemical mechanical polishing (CMP) – also known as planarization – has long been the most commonly employed technique for smoothing and flattening wafer surfaces during the fabrication of ...

ENTG rides AI-driven node migration as advanced chips raise contamination-control needs, boosting consumables demand across filtration, CMP, and etch.

This will expand the role of advanced CMP consumables, high-precision metrology, and contamination control. Epi wafers gain strategic value As device architectures become more demanding, epi quality ...

SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ -- Revasum today announced the availability of 200mm SiC wafer polishing capability on their 6EZ chemical mechanical polishing platform. The 6EZ has ...

A fundamental component of modern electronic goods is the semiconductor. More powerful, faster and smaller processors are in constant demand for many services and goods because of the advent of the ...

Dublin, Oct. 16, 2020 (GLOBE NEWSWIRE) -- The "CMP Equipment and Consumables: Market Analysis and Forecasts" report from The Information Network has been added to ResearchAndMarkets.com's offering.

LONDON — Circuits Multi Projets (CMP), a multiproject wafer run aggregator, has introduced access to a 65-nanometer CMOS process from STMicroelectronics NV. The ST 65-nm library includes process ...