TL;DR: NVIDIA envisions the future of AI compute with innovations like silicon photonics interposers, 3D stacked DRAM, and GPU tiers. The approach includes module-level cooling, die-to-die electrical ...
TL;DR: Intel's cancelled Battlemage GPUs featured innovative 3D-stacked Adamantine cache, promising enhanced performance similar to AMD's Infinity Cache. Despite ambitious designs with up to 40 Xe2 ...
Interesting Engineering on MSN
SK hynix builds innovative cooling solution inside a 3D stacked memory chip
SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...
3D HBM-on-GPU design reaches record compute density for demanding AI workloads Peak GPU temperatures exceeded 140°C without thermal mitigation strategies Halving the GPU clock rate reduced ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
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