5 th-Generation R-Car SoC Offers Future-Proof Multi-Domain Compute Solutions for Centralized E/E Architecture with Chiplet Extensions MUNICH & TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation ...
TOKYO, Japan--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of a virtual development environment that ...
SHANGHAI--(BUSINESS WIRE)--VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS ®) company, today announced its chip design process has obtained ISO 26262 automotive functional ...
New CV3-AD685 System-on-Chip advances Autonomous and Advanced Driver Assistance System (ADAS) applications, providing single-chip solution for multi-sensor fusion and path planning Integrated ...
Developing the electrical/electronic (E/E) systems in automobiles and other vehicles has always been challenging due to the rough environmental conditions experienced on the road and the high ...
New off-the-shelf, cloud-based, digital twin offering, PAVE360 Automotive, empowers automakers and suppliers to begin full-system development on day one, reducing setup time from months to days ...
The partnership will focus on the development of automotive-grade sensor ICs. Credit: Left: Theo Brunner, Continental Automotive, Head of Electronic Purchasing, Right: Yun Sheng, NOVOSENSE Co-Founder ...
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