Silicon Semiconductor

Optimising SiCr deposition for high-yield bipolar-CMOS-DMOS manufacturing with picosecond ultrasonics

With picosecond ultrasonic technology, manufacturers have a powerful, non-destructive tool for monitoring thickness and ...
EDN

Austriamicrosystems, IBM team for CMOS HV process

MUNICH, Germany — IBM and Austriamicrosystems have agreed to share a jointly developed high voltage CMOS manufacturing process. This will enable both companies as well as their foundry customers to ...
Electronic Design

Alliance Produces Ultra-Dense SRAM Cell In 45nm CMOS Technology

The Crolles2 Alliance has described at the VLSI Symposium in Kyoto, Japan, the creation, under production conditions, of six-transistor SRAM-bit cells with an area less than 0.25 square microns—half ...
EDN

Conexant Halts Digital CMOS Production, Cuts 450 Jobs

Conexant Systems Inc. today announced it will discontinue its digital CMOS manufacturing operations and will become a fabless company. The Newport Beach, Calif.-based company also said it plans to cut ...
Electronic Design

Philips Ramps 90-nm CMOS Products Into High-Volume

Philips ramped up three key 90-nm CMOS products into volume production at the Crolles2 Alliance wafer fab in Crolles, France. The products are baseband chips for highly integrated system-inapackage ...
ExtremeTech

Beyond 7nm and silicon: The first III-V CMOS wafers roll off production lines

Imec, perhaps the world's top semiconductor research center, has created the first monolithic III-V CMOS transistors on 300mm silicon wafers. With current silicon-based transistors hitting a wall at ...
Optics

Hybrid laser diode suits CMOS wafer fabrication process

A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
manilatimes

Rayence Expands High-Speed CMOS X-ray Detector "Flash Series" for Semiconductor AXI and 3D X-ray CT Inspection in AI and HBM Manufacturing

HWASEONG, South Korea, March 5, 2026 /PRNewswire/ -- With accelerating global investment in AI infrastructure and surging demand for High Bandwidth Memory (HBM) and AI chips, the need for more precise ...