As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and ...
The shift from planar devices to finFETs enables chipmakers to scale their processes and devices from 16nm/14nm and beyond, but the industry faces several challenges at each node. Cost and technical ...
As semiconductor technology advanced from 65nm to 7nm over the last 10 years, new challenges have arisen in design and manufacturing. Securing the IC yield means developing new methods that respond to ...
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