How new equipment and methodologies are improving reliability, yield, and time-to-market for multi-die assemblies.
Abstract: Hybrid wafer bonding is a key technology for enabling fine-pitch 3D integration, yet its quality remains highly sensitive to wafer warpage and misalignment. This study develops a 3D finite ...
Abstract: In the process of vacuum arc breaking, the axial magnetic field generated by the axial magnetic contact promotes the arc diffusion, and the initial arcing condition has an important ...
OHMS-NetSim is a high-fidelity simulation framework for developing and testing algorithms for Outdoor Heterogeneous Multi-Robot Systems. Built on ROS 2 Humble and Gazebo, it provides a realistic ...
A playground for experimenting with PID, model‑predictive, and machine‑learning–based controllers. DeepPID provides both traditional and neural adaptive controllers in a single, consistent framework, ...
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