Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
One of the shape primitives you'll use most often in your OpenSCAD designs is the cube. Rounding the edges of cube-like objects impacts both the visual appeal and functional aspects of the final ...
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