The largely hidden gold rush in Badakhshan poses considerable risks to Afghans, and others living downstream in Central Asia.
Researchers at University of Tsukuba have developed a cellulose-based composite sheet that integrates paper pulp with starch, ...
Learn how to confidently assess fineness of grind for accurate, consistent results in your quality control process.
How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.
So-called forever chemicals or PFAS compounds are a growing environmental problem. An innovative approach to treating ...
In a case that reads like a mashup of Seabiscuit and Breaking Bad, a New Mexico judge stepped in last month to block the ...
2d
Harpak-ULMA Launches High-Speed Grind-Line Tray-Sealing Application Powered by Mondini Sinfonia(R)
Harpak-ULMA announced a new application of the Mondini Trave Sinfonia(R) tray-sealing platform designed explicitly for high-volume ground-meat production. The solution delivers a higher-output, fully ...
The semiconductor industry has never been pickier about gas purity. As chip designs shrink below seven nanometers, ...
Background Foodborne diseases are an important cause of global morbidity and mortality, particularly among children who often ...
Researchers at University of Tsukuba have developed a cellulose-based composite sheet that integrates paper pulp with starch, polyaniline (a conductive polymer), Prussian blue (a coordination compound ...
Market valued at $72.4M in 2024, projected 7.30% CAGR growth driven by pharmaceutical API synthesis, food-grade ...
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW cross-contamination and back-flow can be optimised with the Malema Interconnect ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback