Abstract: Fusion and hybrid wafer-to-wafer bonding are key enabling processes for device scaling and wafer level packaging. Shrinking technology nodes combined with raising wafer complexities require ...
The purpose of this repository is to provide a few sample prompts used in order to create a simple Python GUI for the Linux desktop project. I created this repository and wrote these prompts on March ...
Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
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